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| LQP03TN8N2H00D资料 | |
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LQP03TN8N2H00D PDF Download |
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File Size : 116 KB
Manufacturer:MURATA Description:Each power pin must have its own set of blocking capacitors. An external reference must be used. VSSA and VSS must be connected on the LQP03TN8N2H00DCB level. The two power pads can be bonded to one package pin (double bonding). Two more LQP03TN8N2H00D cells can be driven with IREFxx of the LQP03TN8N2H00DERXBIAS cell. If an output IREFxx is not used it must be left unconnected. The LQP03TN8N2H00DECL part of the chip has to be separated from the rest of the chip by use of snap backs (cell LQP03TN8N2H00DWRCUT_DIG_LQP03TN8N2H00D_SNALQP03TN8N2H00D_SNALQP03TN8N2H00D). The cells VDD3R1LQP03TN8N2H00D and VDD3R2LQP03TN8N2H00D are not in the standard library, they are part of the ILQP03TN8N2H00D-block. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：LQP03TN8N2H00D 厂 家：MURATA 封 装：06+ 批 号：SMD 数 量：150000 说 明：【自己库存】 |
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运 费： 所在地： 新旧程度： |
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| 联系人：陈生 |
| 电 话：0755-82565235.0755-88391555.0755-82807567 |
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