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| GRM36X7R153K16资料 | |
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GRM36X7R153K16 PDF Download |
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File Size : 116 KB
Manufacturer:MURATA Description: For more information on the PWP package, refer to TI technical brief, literature number SLMA002. Test board conditions: 1. 3 x 3, 4 layers, thickness: 0.062 2. 1.5 oz. copper traces located on the top of the PCB 3. 1.5 oz. copper ground plane on the bottom of the PCB 4. 0.5 oz. copper ground planes on the 2 internal layers 5. 12 thermal vias (see Recommended Land Pattern in applications section of this data sheet) (3) Maximum power dissipation may be limited by over current protection. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：GRM36X7R153K16 厂 家：MURATA 封 装：06+ 批 号：SMD 数 量：120000 说 明：【自己库存】 |
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运 费： 所在地： 新旧程度： |
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| 联系人：陈生 |
| 电 话：0755-82565235.0755-88391555.0755-82807567 |
| 手 机：13798377798 |
| QQ：819175396,302677436,343000888 |
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| 传 真：0755-83177555 |
| EMail：mwdsmd@126.com |
| 公司地址： 深圳市福田区振中路鼎诚国际1018室 |
