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| GRM31CR72E333KW03L资料 | |
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GRM31CR72E333KW03L PDF Download |
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File Size : 116 KB
Manufacturer:MURATA Description:Note 2: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink thermal values. J-A for TO-220 devices is 65˚C/W if no heatsink is used. If the TO-220 device is attached to a heatsink, a J-S value of 4˚C/W can be assumed. J-A for TO-263 devices is approximately 35˚C/W if soldered down to a copper plane which is at least 1 square inch in area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal shutdown. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：GRM31CR72E333KW03L 厂 家：MURATA 封 装：06+ 批 号：SMD 数 量：240000 说 明：【自己库存】 |
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运 费： 所在地： 新旧程度： |
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| 联系人：陈生 |
| 电 话：0755-82565235.0755-88391555.0755-82807567 |
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