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| GRM21BF51E105ZA01L资料 | |
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GRM21BF51E105ZA01L PDF Download |
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File Size : 116 KB
Manufacturer:MURATA Description:3. Die Attach a. Eutectic Eutectic die attach can be accom- plished by scrubbing the die with/without a preform on the header to combine with the silicon in the die. Temperature is approxi- mately 400C, with heating times of 5-10 seconds. (NoteCtimes and temperature utilized may vary depending on the type, composi- tion, and heat capacity of the header or substrate used.) This method is recommended for the HPND-000X series. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：GRM21BF51E105ZA01L 厂 家：MURATA 封 装：06+ 批 号：SMD 数 量：320000 说 明：【自己库存】 |
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运 费： 所在地： 新旧程度： |
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| 联系人：陈生 |
| 电 话：0755-82565235.0755-88391555.0755-82807567 |
| 手 机：13798377798 |
| QQ：819175396,302677436,343000888 |
| MSN：mwdsmd@hotmail.com,xiaowei700@hotmail.com |
| 传 真：0755-83177555 |
| EMail：mwdsmd@126.com |
| 公司地址： 深圳市福田区振中路鼎诚国际1018室 |
