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| GRM2195C2A680JZ01D资料 | |
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GRM2195C2A680JZ01D PDF Download |
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File Size : 116 KB
Manufacturer:MURATA Description:Thermocompression bonding is recommended. Welding or conductive epoxy may also be used. For additional information see Application Note 979, The Handling and Bonding of Beam Lead Devices Made Easy, or Application Note 993, Beam Lead Device Bonding to Soft Substrates. |
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| 相关型号 | |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：GRM2195C2A680JZ01D 厂 家：MURATA 封 装：06+ 批 号：SMD 数 量：320000 说 明：【自己库存】 |
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运 费： 所在地： 新旧程度： |
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| 联系人：陈生 |
| 电 话：0755-82565235.0755-88391555.0755-82807567 |
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