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| GNM30-401X7R103M25资料 | |
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GNM30-401X7R103M25 PDF Download |
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File Size : 116 KB
Manufacturer:MURATA Description:These devices do not normally require heat sinks, however, standard precautionary design and layout procedures should be used to ensure devices do not overheat. The ground and power planes beneath the package, as well as all pcb signal runs to and from the device, should be as heavy as possible to help conduct heat away from the package. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：GNM30-401X7R103M25 厂 家：MURATA 封 装：06+ 批 号：SMD 数 量：120000 说 明：【自己库存】 |
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运 费： 所在地： 新旧程度： |
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| 联系人：陈生 |
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