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| 1812B224K101NT资料 | |
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1812B224K101NT PDF Download |
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File Size : 116 KB
Manufacturer:WALSIN Description:The component placement around the LDO should be done carefully to achieve good dynamic line and load response. The input and noise capacitor should be kept close to the LDO. The rise in junction temperature depends on how efficiently the heat is carried away from the junction to ambient. The junction to lead thermal impedance is a characteristic of the package and fixed. The thermal impedance between lead to ambient can be reduced by increasing the copper area on PCB. Increase the input, output and ground trace area to reduce the junction-to-ambient impedance. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：1812B224K101NT 厂 家：WALSIN 封 装：06+ 批 号：SMD 数 量：120000 说 明：【自己库存】 |
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运 费： 所在地： 新旧程度： |
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| 联系人：陈生 |
| 电 话：0755-82565235.0755-88391555.0755-82807567 |
| 手 机：13798377798 |
| QQ：819175396,302677436,343000888 |
| MSN：mwdsmd@hotmail.com,xiaowei700@hotmail.com |
| 传 真：0755-83177555 |
| EMail：mwdsmd@126.com |
| 公司地址： 深圳市福田区振中路鼎诚国际1018室 |
